Earlier quoted context omitted.
Apple puts the RAM in the chip package because they integrate the GPU, and then they want to be able to have multiple channels to feed the GPU without having that many slots. (Their entry level models also don't have any more memory bandwidth than normal PC laptops and there is no real reason they couldn't use a pair of SODIMMs.) But low end iGPUs don't need a lot of memory bandwidth (again witness Apple's entry leve…
> integrating high end GPUs makes you thermally limited. Even if you have a surface area equivalent to a high end cpu and high end gpu, combined in a single die?
Separate packages get you more space, separate fans, separate power connectors, etc.
In theory you could do the split in a different way, i.e. do SMP with APUs like the MI300X, and then you have multiple sockets with multiple heatsinks but they're all APUs. But you can see the size of the heatsink on that thing, and it's really a GPU they integrated some CPU cores into rather than the other way around. The power budget is heavily disproportionately the GPU. And it's Enterprise Priced so they get to take the "nobody here cares about copper or decibels" trade offs that aren't available to mortals.