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That is a very high quality video. One thing I am curious about - how many generations of process shrink is one of these machines good for? They talk about regular EUV and then High-NA EUV for finer processes, but presumably each machine works for multiple generations of process shrink? If so, what needs to be adjusted to move to a finer generation of lithography and how is it done? Does ASML come in and upgrade the…
If you’re interested in this stuff Asianometry has lots of great videos. They’re not all on semiconductors, but he’s done a lot on this history, developments, and what’s going on in that world. https://www.youtube.com/c/Asianometry/videos
Even the video about zippers was fascinating.
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They might be referring to Substack having a very open policy of having writers of any political (and other) affiliation on the platform, but I don't necessarily see it as a drawback to be so neutral.
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It’s a mind blowing achievement, nothing below sorcery if you think about it. ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%. Here’s an incredible, very detailed video about it: htt…
That is a really cool video, thank you! Maybe the high water usage is at some other stage? Or intermediate preceding stages? I'd love to understand more end-to-end, as surely it isn't as easy as popping a wafer in a semi-truck trailer sized lithography machine.