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Apple A19 SoC die shot

chipwise.tech

31–40 of 80 posts

Re: Apple A19 SoC die shot

#31

Anyone interested in more info and detailed videos should check out Geekerwan: https://youtu.be/Y9SwluJ9qPI English subtitles are recommended, unless you are better at Chinese than I am.

The interesting part is the E-Core on A19 Pro are nearly as good as the previous ARM Big Core while only using half the power. I would love to know the die size of the cache and E-Core.

ARM were catching up to Apple in terms of big core, now Apple has leapfrogged in E-Core again. But competition is good. ARM should have some announcement coming in next few months.

Re: Apple A19 SoC die shot

#32

Anyone interested in more info and detailed videos should check out Geekerwan: https://youtu.be/Y9SwluJ9qPI English subtitles are recommended, unless you are better at Chinese than I am.

Is there some magic with AI that lets you watch those videos dubbed in English?

Re: Apple A19 SoC die shot

#34
post #20
post #13

Do TSMC current node sizes allow for Backside Power Delivery (BPD)? As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening. Please correct me if I'm wrong.

There is no backside anything here. This may be a photo of a thinned die; silicon is somewhat transparent so you can often see the die structures better from the back because it isn't blocked by the metal stack.

It will be a shame when backside power delivery makes that not work as well.

Re: Apple A19 SoC die shot

#35
post #5

Earlier quoted context omitted.

It's definitely an "on the shoulders of giants standing on the shoulders of giants" thing. Insane breakthrough technologies on top of other insane breakthroughs. Firing lasers at microscopic molten drops of metal in a controlled enough manner to get massively consistent results like what??

It’s a mind blowing achievement, nothing below sorcery if you think about it. ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%. Here’s an incredible, very detailed video about it: htt…

That is a very high quality video.

One thing I am curious about - how many generations of process shrink is one of these machines good for? They talk about regular EUV and then High-NA EUV for finer processes, but presumably each machine works for multiple generations of process shrink? If so, what needs to be adjusted to move to a finer generation of lithography and how is it done? Does ASML come in and upgrade the machine for the next process generation, or does it come out of the box already able to deliver to a resolution a few steps beyond the current state of the art?

Re: Apple A19 SoC die shot

#37

Earlier quoted context omitted.

It’s a mind blowing achievement, nothing below sorcery if you think about it. ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%. Here’s an incredible, very detailed video about it: htt…

That is a very high quality video. One thing I am curious about - how many generations of process shrink is one of these machines good for? They talk about regular EUV and then High-NA EUV for finer processes, but presumably each machine works for multiple generations of process shrink? If so, what needs to be adjusted to move to a finer generation of lithography and how is it done? Does ASML come in and upgrade the…

If you’re interested in this stuff Asianometry has lots of great videos. They’re not all on semiconductors, but he’s done a lot on this history, developments, and what’s going on in that world.

https://www.youtube.com/c/Asianometry/videos

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