It’s still my strongly held belief that things like this are one of humanity’s grandest achievements.
Nah, NVIDIA GPU has way more raw computational power & smarts.
Apple A19 SoC die shot
11–20 of 80 posts
Re: Apple A19 SoC die shot
#12Re: Apple A19 SoC die shot
#13Do TSMC current node sizes allow for Backside Power Delivery (BPD)?
As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening.
Please correct me if I'm wrong.
Re: Apple A19 SoC die shot
#14Well I see the 'die shot,' but not the 'analysis'
Re: Apple A19 SoC die shot
#15Well I see the 'die shot,' but not the 'analysis'
Unfortunately I think think you have to pay for the analysis and high resolution pics.
Re: Apple A19 SoC die shot
#16Missing Anandtech.com right about now
/me pours one out
Re: Apple A19 SoC die shot
#17Earlier quoted context omitted.
Yeah if you scroll down they tell you how
I scrolled down, and there is only 1 paragraph of text and two blurry images. What did you scroll down to?
Next to the paragraph of text is this:
"High Resolution Floorplan images available here"
With some contact info below that
It is moved to the end of the page on mobile it seems
Re: Apple A19 SoC die shot
#18It’s still my strongly held belief that things like this are one of humanity’s grandest achievements.
It's definitely an "on the shoulders of giants standing on the shoulders of giants" thing. Insane breakthrough technologies on top of other insane breakthroughs. Firing lasers at microscopic molten drops of metal in a controlled enough manner to get massively consistent results like what??
It’s a mind blowing achievement, nothing below sorcery if you think about it.
ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%.
Here’s an incredible, very detailed video about it: https://youtu.be/B2482h_TNwg
Re: Apple A19 SoC die shot
#19Do TSMC current node sizes allow for Backside Power Delivery (BPD)? As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening. Please correct me if I'm wrong.
No backside power delivery on TSMC yet, even at 2nm. It's supposed to come on TSMC's A16 node.
I think what you're seeing is the silicon layers visible from the back through the bulk substrate, and the metal layers on the front.
Re: Apple A19 SoC die shot
#20Do TSMC current node sizes allow for Backside Power Delivery (BPD)? As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening. Please correct me if I'm wrong.
There is no backside anything here. This may be a photo of a thinned die; silicon is somewhat transparent so you can often see the die structures better from the back because it isn't blocked by the metal stack.