Earlier quoted context omitted.
It's the same issue that was behind NVDAs "soldergate" fuck-up that ended up permanently souring the relationship between them and Apple. The core is EU's regulation on lead free solder, which led to a number of people finding out that thermal cycling on the solder led to thermal stresses. Workarounds were identified and any solder formulations since then don't suffer from that issue, so the fix is a complete re-ball…
Sounds like a R&D problem. Why the dig at the EU?
At this point, the directive may have caused more e-waste and environmental damage from part failures than the damage the original leaded soldier would have caused.