111–120 of 136 posts
https://www.youtube.com/watch?v=HW5Fvk8FNOQ
BBC Horizon: 1977-1978 Now The Chips Are Down
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Nope, Zeloof got most of the stuff on Craigslist and Ebay. The big stuff is usually pretty old, and alot is hacked together (e-beam stepper) or custom built entirely (sputtering chamber, or whatever the plasma machine is called I forget).
He also purchased a decommissioned, broken electron microscope from a university lab on eBay, and repaired it by himself.
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Found another, more technical video, but couldn't recognize anything about process node/feature size. Anyways, here it is: [1] https://www.youtube.com/watch?v=hViCDab0E2A
Nikkei Article from December 2016 mentioning 0.8 micron, while aiming for 0.35 micron in 2018. So that's it, i guess? [1] https://asia.nikkei.com/Business/Biotechnology/Minimal-fab-t... According to wikipedia the following CPUs were built with that: [2] https://en.wikipedia.org/wiki/350_nanometer Which i think of as more than sufficient to finally being able to implement something like SCED, WAM, CHERI, Applecore, wh…
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You're overhyping the knowledge a bit. It can't have been gathered over that great a span of time because he was only in his late teens when he did this. Also I've been able to work out most of it myself over a period of about a year using the book "Introduction to Semiconductor Manufacturing Technology" by Hong Xiao for general process layout (what steps are necessary, in what order, with what chemicals, etc.) and a…
Do you have a list of the papers you found helpful in addition to the book?
Kirt R. Williams, Kishan Gupta, Matthew Wasilik - Etch Rates for Micromachining Processing—Part II
Mark R. Jackson - Effects of Radio Frequency Power and Sulfur Hexafluoride Flowrate on Etch Rate of Silicon Dioxide
S. A. Moshkalyov, C. Reyes-Betanzo, R.C. Teixeira, I. Doi, M.B. Zakia, J.A. Diniz, J. Swart - Etching of Polycrystalline Silicon in SF6 Containing Plasmas
I.J. Kima, H.K. Moona, J.H. Leea, N.E. Leea, J.W. Jungc, S.H. Cho - Silicon nitride etch characteristics in SF6/O2 and C3F6O/O2 plasmas and evaluation of their global warming effects
http://microchem.com/pdf/PMMA_Data_Sheet.pdf
These for further general process design/example values:
http://ww2.che.ufl.edu/unit-ops-lab/experiments/semiconducto...
These are by no means the be all and end all, they were just useful for the parts of the process I've looked at in detail so far and there are often several options at every step for chemicals and approaches, these were suited to what I was aiming for.
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Nope, Zeloof got most of the stuff on Craigslist and Ebay. The big stuff is usually pretty old, and alot is hacked together (e-beam stepper) or custom built entirely (sputtering chamber, or whatever the plasma machine is called I forget).
He also purchased a decommissioned, broken electron microscope from a university lab on eBay, and repaired it by himself.
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Is this what people actually do? I mean I'm aware I could neutralize them, but Cu is still going to be in there and I still can't pour this stuff down the drain. Then there's ferric chloride which is just nasty stuff that will likely stain everything it comes in contact with. I just want to get rid of it in a fully environmentally safe way.
I'm not sure it is economical, but I had some Sodium Persulfate etchant that was full of copper and accidentally dropped a piece of steel in it. The copper plated onto the steel almost instantly. You could probably use iron filings (or some metal that won't dissolve in your acid) to pull most of the copper out of the acid, and then neutralize. I'm not sure what you would do with the solid copper after that. It might…
I was at Semicon Japan last year in December and I learn about the coolest semiconductor company (non profit research organization) ever - MinimalFab [1]. There isn't much information their website but this [2] video explains what MinimalFab is about. Essentially, it is a cleanroom-free, modularized fab where each process step in a fab is like a little ATM machine. Miniaturization of complex fab processes is mind blo…
Thanks for this info.
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That's cool, but your [1] seems to say that the machine uses a wafer 12.5 mm in diameter, which is is probably less area than any of the CPUs in your [2].
Should suffice for my needs, see for example here [1] https://en.wikipedia.org/wiki/R4200 under R4300i which mentions 45mm² for the die. Also mentioned here [2] https://bits-chips.nl/artikel/small-series-of-chips-profitab... are 0.25-micron to be released this year, with 190nm and smaller on the roadmap. Which leads us to [3] https://en.wikipedia.org/wiki/250_nanometer at least. Maybe not comparable in die size for a…