I don't think you can really avoid it when trying to pack everything as densely as possible. A few years down the road, I believe, an SoC will probably contain not only the CPU, graphics, audio, etc., but also RAM. Probably stacked onto the CPU connected with through-silicon vias. All you'll see in an ifixit teardown is a single chip made entirely from nanoscale silicon structures. There'll be nothing a user can even see. The upside, however, is that such a level of integration gives you a power advantage, a price advantage and a size advantage.
Just recently, when Broadwell was released, Intel boasted how small their chips have become. This is necessary to make the as-thin-as-possible design of Ultrabooks and it's a trend that's not going to go away because having an Ultrabook in your bag is so much better than any other kind of laptop.
I don't really know how it would be possible to make an Ultrabook at that size still modular like a tower PC.