think of soldering as a thermodynamic and metallurgical system to create a solid mechanical/electrical joint - so while welding is a good analogy, it doesn't really give you a good model on what is going on. to get really good at soldering is to get good at understanding the interplay of the factors involved and then predict/manage them.
fundamental to all this is to recognize that the solder is an alloy with eutectic property -- unlike regular metals/alloys, solder doesn't slowly get mushy and then become a molten liquid; instead, at a precise (band) of temp, it just melts, and then when heat is removed/lowered it instantly solidifies. that is why controlling tip temp is critical first step.
second is the thermal mass of the soldering surface; usb/ethernet connectors have higher thermal mass so to achieve eutectic, you need a beefier tip that can deliver, not a thinner tip and holding it longer; higher than normal temps helps here. for smd led, the opposite applies;
third, is the concept of wettability -- thermodynamic affinity between the molten solder and the solid metal pad; to form a perfect bond between the metals, they must be clean and free of oxides, and applying flux reduces these oxides. High wettability means the solder eagerly spreads out and adheres to the surface rather than forming isolated droplets. That's the working principle when drag soldering.
then there is angle of solder tip, fine motor control, etc -- those are easy to come by. I am not a technician, and I was able to drag solder a lqfp64 with not a lot of trouble. of course, i hate school of hard knocks, so i spent time learning about the process first.
Suggested reading: https://www.amazon.com/Basic-Soldering-Guide-Alan-Winstanley...