I think they talked about this being general purpose chip but I would think that Anthropic/OpenAI are at the scale now they could bake LLM weights into chips themselves. For example, GPT Sol baked into a custom chip run for $100M that runs 10x as fast and 10x as cheap should pay for itself as long as the chip is useful for long enough. While 2 years ago nothing was useful more than 1 year long, there are many older m…
Probably! But not viable yet; the chips would be about a year behind SOTA. Note the ~16 months that the article quotes as being insanely fast to get this chip to tape-out (read: start producing). We'll have to bootstrap our way there: AI is actively being used to get us closer to viable lead times for this. Unfortunately, there's some real physical constraints: IIRC, manufacturing a wafer takes on the order of a mont…
https://www.eetimes.com/taalas-specializes-to-extremes-for-e...
https://www.turingpost.com/p/taalas
https://cambrian-ai.com/taalas-launches-hardcore-chip-with-i...
Part of the key is that by moving even from 6nm to 3-4nm one could embed a 20-30B model as part of a MoE (or only a subset of activated layers) on a single reticle die (note B300s are already multi-reticle), with a separate predictive/dispatch model controlling them each on a separate chip. This is without even stacking CiM ROM die. Moving the layer activations (and KV cache etc) between die requires relatively high speeds (and low latency), but distributed with multiple die in parallel might well be doable even with standard multilane PCIe. Of course KV cache prefill could also be handled by external GPUs. I'm sure AMD will make some reasonable choices.