The "Claude's propensity to reward hack" line is the interesting part to me. We run a small system where AI agents (scripts, LLMs) act as the actual players in a persistent simulation, and reward-hacking-style behavior shows up constantly once an agent is left running unsupervised for a long time - it finds the shortest path to whatever metric you exposed, not the path you intended. Curious whether you've found any m…
Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
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Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#12I've seen this concept of using LLM/AI/etc for high throughput discovery of materials so, so often in the past 5 or so years and yet there hasn't really been any impact as a result. I think this is the first one that has actually taken the pain to say how many of the discovered materials are actually feasible which is a real step in the right direction. Probably worth keeping in mind the step beyond plausible synthes…
Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#13asking because i hit the same shape in a much dumber domain and what got me was that the failures were quiet. nothing errored, output looked normal, it was just wrong in a way only someone who knew the domain would catch.
Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#14the 8 hours vs 2 weeks framing is the part i'd want more on. generating candidates got cheap, checking them didn't. what does the funnel actually look like ,of the candidates from an 8 hour run, how many make it to synthesis? asking because i hit the same shape in a much dumber domain and what got me was that the failures were quiet. nothing errored, output looked normal, it was just wrong in a way only someone who k…
We found that speaking to domain experts was critical in desigining a rubric that could catch these silent synthesis recipe failures, before we attempt the longer 2 week synthesis effort.
Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#15The "Claude's propensity to reward hack" line is the interesting part to me. We run a small system where AI agents (scripts, LLMs) act as the actual players in a persistent simulation, and reward-hacking-style behavior shows up constantly once an agent is left running unsupervised for a long time - it finds the shortest path to whatever metric you exposed, not the path you intended. Curious whether you've found any m…
Also curious: by what reasoning path do models typically end up reward hacking?
Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#16Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#17Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#18What about aperiodic materials ? Does that go beyond (computationally) normal requirements ?
Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#19What about aperiodic materials ? Does that go beyond (computationally) normal requirements ?
Aperiodic materials can also be studied. The number of atoms and cell size of what you want to simulate is more the limiting requirement computationally. Aperiodic materials weren't in this benchmark. Generally amorphous materials and polymers, with a few exceptions are < 2-3 W/(m K) in thermal conductivity. So we left them out of this study.
Was specifically thinking of quasicrystalline materials and not amorphous. I know some of them have very unconventional properties so I figured they might be useful here. I don't think any of them are considered polymers but I could be wrong.
For example (no personal connection):
https://arxiv.org/abs/2409.07735
Wouldn't they require a totally different type of algorithm given that they often contain both a large number of atoms and odd cell size ? And the more dimensionally complex maths
Re: Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials
#20What about HBM on the back side of the chip ? Essentially I'm thinking like a soldered on piece or another "socket" with pins like a CPU in the back of the motherboard. We rare see cooling elements there already and while most rack mount cases are not at all designed for more space there I don't see why it couldn't be a thing. Especially with liquid cooling.
Also makes me think of possibly using Gallium Nitride instead of silicone for surface levels elements ? Or maybe even an interface layer on top or bottom of the chip designed to be able to transmit power with less heat. Maybe that could be sandwiched between the chip and HBM.