351–360 of 396 posts
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Imagine if they bring back the Mac Pro with 768GB of ram to compete with the $100k DGX Station.
The timing of the demise of the Mac Pro has been about as bad as the Steam Machine launch timing.
768GB RAM pipe dreams make no sense to Apple. By discontinuing 256GB / 512GB M3 Ultra and raising prices $5000 -> $7000 on Macbook pro with 128GB they basically confirmed how badly RAM shortage affecting them. 768GB is 64-times of 12GB which is rumored to be amount of RAM in new iPhones. Imagine what profit margin 768GB Mac Studio gonna need in order to justify making one instead of 64 iPhones. Apple is the company t…
The message I’m getting is that Apple will never compromise on its healthy margins. If something becomes basically unaffordable for their target market, they’d cut the production and even discontinue the product, than take a hit on margins. Their business model is refreshingly simple.
Once/if the ram shortage ends, they will continue increasing the ram caps as they were already doing, because then selling ram-heavy macs will not interfere with the rest of their products.
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You can start by reading up on TSMC's name for the tech (although there are many versions at TSMC and TSMC isn't the only company packaging chiplets and memory on top of a silicon interposer). > CoWoS (Chip-on-Wafer-on-Substrate) https://semiwiki.com/wikis/industry-wikis/cowos-chip-on-wafe... It's a more advanced update from their older InFO tech.
As your article states, they're already using CoWoS; that's not a new technology for Apple to adopt. Also, InFO-oS is a CoWoS technique.
The article compares CoWoS to InFO.
> CoWoS uses a passive silicon interposer—etched with thousands of fine interconnects—that sits between the active dies and the package substrate. This interposer provides high-density connections between chiplets and supports memory integration, most notably High Bandwidth Memory (HBM) stacks.
It also mentions that CoWoS is the tech used to build Nvidia's high end AI accelerators.
> AI Accelerators: Nvidia H100, B100 (HBM3 via CoWoS)
Apple is taking a tech that has previously only been used in very high end enterprise applications and is using it to make consumer SOCs starting with this years iPhone.
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Blaming the user, nice to see apple traditions still respected.
It just doesn't seem like a problem. If you put too many icons somewhere than fit in that place, of course you're going to run out of space…
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The message I’m getting is that Apple will never compromise on its healthy margins. If something becomes basically unaffordable for their target market, they’d cut the production and even discontinue the product, than take a hit on margins. Their business model is refreshingly simple.
It's just a planned economy failing the way planned economies often do: the central planner failed to predict the demand correctly. Instead of trying to secure additional stock from the market at spot prices, they are simply waiting for the next batches they had planned for.
What’s really happening is that the effort of securing additional stock isn’t worth it because the price is so high that there aren’t enough buyers.
If ground beef were to suddenly cost $50/pound, McDonald’s doesn’t raise the price of the Big Mac to $25 and hope people buy it, because it makes zero sense for their business model. Sure, some fancy restaurant will still be selling hamburgers, but not your chain of thousands of working class fast food restaurants. McDonald’s would find some other alternative item to sell.
The truth is that nobody’s going to be buying Mac Studios that cost $25,000. Not even enterprises.
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As your article states, they're already using CoWoS; that's not a new technology for Apple to adopt. Also, InFO-oS is a CoWoS technique.
InFO combines chiplets, but does not do so by bonding multiple chiplets directly to a silicon interposer as CoWoS does. The article compares CoWoS to InFO. > CoWoS uses a passive silicon interposer—etched with thousands of fine interconnects—that sits between the active dies and the package substrate. This interposer provides high-density connections between chiplets and supports memory integration, most notably High…
Something's got to give here. I think it's your original article that's wrong, and it's poorly trying to describe InFO-M.
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I worked at a hyperscaler when the M1 came out. A MacBook Air M1, running a Linux VM was faster and more energy efficient than anything we had in the data center.
I'm certainly willing to believe the M1 was the most energy efficient, but your data center didnt have anything faster than a laptop?
(All the usual caveats about geekbench scores apply, but they're not nothing.)
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It’s a complete embarrassment. They added it for aesthetic alignment with the iPhone 13. And then the 14 removed the notch soon after. They’ve kept it for years since then. It has no functional purpose. It’s not there for face ID or because they couldn’t figure out how to do a hole punch camera.
It's there to give you more screen space...
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Except that it hides stuff...
If you have that much in your menubar you have bigger problems
Elaborate on my problems... or help me fix them.
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It has at the current subsidised prices.
I doubt inference costs will scale up significantly, but even if they do, it simply strengthens the strategic case for Apple's focus on local inference.
Investors are expecting trillions of dollars to come out of this play. That's only possible through monopoly pricing essentially.
"Being a profitable business", which selling tokens could absolutely be, is not sufficient. They need to own a large chunk of the world