Earlier quoted context omitted.
Probably not, at least for DRAM. The demand has historically been very variable, and building production capacity takes multiple years. Also, spare capacity is really expensive. Thus the memory manufacturers don't want to expand, betting on it being yet another temporary bubble. Also, DRAM fabs are not really usable to make compute (CPU, GPU, etc in this context) silicon. The production lines and tech have diverged s…
How did Apple figure this out? Isn't the solution to this to sort of evolve to a unified memory architecture, which wins in speed and cost anyway?
There are a few different variation, such as having a carrier chip below (as an interconnect), having a small PCB that everything is mounted to, or even vertically stacking chips (AMD's 3D v-cache does this on some of their CPU models).