Finding a CPU Design Bug in the Xbox 360 (2018)
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Finding a CPU Design Bug in the Xbox 360 (2018)
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Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#2Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#3The high failure rates of the Xbox 360 did not help.
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#4It is interesting that IBM dominated this generation of consoles, and was vanquished in the next. The high failure rates of the Xbox 360 did not help. https://en.wikipedia.org/wiki/Xbox_360_technical_problems
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#5It is interesting that IBM dominated this generation of consoles, and was vanquished in the next. The high failure rates of the Xbox 360 did not help. https://en.wikipedia.org/wiki/Xbox_360_technical_problems
I thought the design flaws of the Xbox 360 cooling system had more to do with Microsoft than any inherent design flaw by IBM. I assumed that switching to x86 processors let Microsoft leverage their native developer tools from Windows which helped developers.
"Microsoft did not reveal the cause of the issues publicly until 2021, when a 6-part documentary on the history of Xbox was released. The Red Ring issue was caused by the cracking of solder joints inside the GPU flip chip package, connecting the GPU to the substrate interposer, as a result of thermal stress from heating up and cooling back down when the system is power cycled."
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#6Earlier quoted context omitted.
I thought the design flaws of the Xbox 360 cooling system had more to do with Microsoft than any inherent design flaw by IBM. I assumed that switching to x86 processors let Microsoft leverage their native developer tools from Windows which helped developers.
The main issue was revealed to be solder. "Microsoft did not reveal the cause of the issues publicly until 2021, when a 6-part documentary on the history of Xbox was released. The Red Ring issue was caused by the cracking of solder joints inside the GPU flip chip package, connecting the GPU to the substrate interposer, as a result of thermal stress from heating up and cooling back down when the system is power cycled…
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#7Earlier quoted context omitted.
The main issue was revealed to be solder. "Microsoft did not reveal the cause of the issues publicly until 2021, when a 6-part documentary on the history of Xbox was released. The Red Ring issue was caused by the cracking of solder joints inside the GPU flip chip package, connecting the GPU to the substrate interposer, as a result of thermal stress from heating up and cooling back down when the system is power cycled…
Sounds like the 2012(?) Macbook Pro after the switch to leadless solder (?). I had to cook my motherboard 3 times in the oven to revive it.
I've heard that flash memory can also be revived with heat, either long duration or high intensity.
https://www.extremetech.com/science/142096-self-healing-self...
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#8Earlier quoted context omitted.
I thought the design flaws of the Xbox 360 cooling system had more to do with Microsoft than any inherent design flaw by IBM. I assumed that switching to x86 processors let Microsoft leverage their native developer tools from Windows which helped developers.
The main issue was revealed to be solder. "Microsoft did not reveal the cause of the issues publicly until 2021, when a 6-part documentary on the history of Xbox was released. The Red Ring issue was caused by the cracking of solder joints inside the GPU flip chip package, connecting the GPU to the substrate interposer, as a result of thermal stress from heating up and cooling back down when the system is power cycled…
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#9Earlier quoted context omitted.
The main issue was revealed to be solder. "Microsoft did not reveal the cause of the issues publicly until 2021, when a 6-part documentary on the history of Xbox was released. The Red Ring issue was caused by the cracking of solder joints inside the GPU flip chip package, connecting the GPU to the substrate interposer, as a result of thermal stress from heating up and cooling back down when the system is power cycled…
And there was the same problem with early PS3s, on Nvidia's GPU package...it was a fairly widespread problem at the time.
Re: Finding a CPU Design Bug in the Xbox 360 (2018)
#10Earlier quoted context omitted.
The main issue was revealed to be solder. "Microsoft did not reveal the cause of the issues publicly until 2021, when a 6-part documentary on the history of Xbox was released. The Red Ring issue was caused by the cracking of solder joints inside the GPU flip chip package, connecting the GPU to the substrate interposer, as a result of thermal stress from heating up and cooling back down when the system is power cycled…
And there was the same problem with early PS3s, on Nvidia's GPU package...it was a fairly widespread problem at the time.