Thermoelectric cooling is pretty inefficient, because the materials need to balance competing requirements: - Good thermal insulator - Good electrical conductor - Good semiconductor This is because the hot & cold sides are sandwiched closely together as a PN junction, so once you move heat from one side to the other, it just leaks right back. Mechanical cooling doesn't have this problem, because the hot & cold sides…
I'm thinking of the separation walls in counterflow heat exchangers (only useful at the end where the incoming stream is closer to its end temperature than the delta offered by thermoelectrics I guess). Can it do whatever it does across a temperature gradient?