AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
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Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#2Dummy silicon, in the same way as the majority of Leonardo's Mona Lisa is dummy wood panel (which supports the painting applied on top of it and ensures its structural integrity)? But how is this different from other chips out there? Ok, I get it that this is because of the chiplet technology used, but in a "traditional" chip the dummy silicon that provides the structural integrity would just be part of the chip, while in this case it's separate?
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#3Dummy silicon, in the same way as the majority of Leonardo's Mona Lisa is dummy wood panel (which supports the painting applied on top of it and ensures its structural integrity)? But how is this different from other chips out there? Ok, I get it that this is because of the chiplet technology used, but in a "traditional" chip the dummy silicon that provides the structural integrity would just be part of the chip, whi…
It says so in the article itself:
>Excluding interconnects, the SRAM and CCD should add up to less than 20µm thick. To accommodate such small and fragile components, AMD has added a bulky layer of dummy silicon at the top and the bottom for structural integrity.
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#4Dummy silicon, in the same way as the majority of Leonardo's Mona Lisa is dummy wood panel (which supports the painting applied on top of it and ensures its structural integrity)? But how is this different from other chips out there? Ok, I get it that this is because of the chiplet technology used, but in a "traditional" chip the dummy silicon that provides the structural integrity would just be part of the chip, whi…
Yes. The article is click bait. With such a title I would have expected majority of the area to be dummy, but it is just structurally more silicon, exactly like a picture may be majority of its mass wood.
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#5Dummy silicon, in the same way as the majority of Leonardo's Mona Lisa is dummy wood panel (which supports the painting applied on top of it and ensures its structural integrity)? But how is this different from other chips out there? Ok, I get it that this is because of the chiplet technology used, but in a "traditional" chip the dummy silicon that provides the structural integrity would just be part of the chip, whi…
It says so in the article itself: >Excluding interconnects, the SRAM and CCD should add up to less than 20µm thick. To accommodate such small and fragile components, AMD has added a bulky layer of dummy silicon at the top and the bottom for structural integrity.
The article doesn't answer questions like whether this is unusual, if other CPUs historically have had a lot of dummy silicon, whether this is expensive or how it impacts the cost of production or how it affects the complexity of production itself. It's what I'd expect from modern journalism, but not really what I expect from good journalism.
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#6> the findings of his first report suggest that a large part of the Ryzen 7 9800X3D is just dummy silicon for structural integrity.
Since when is material for structural integrity dummy?
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#7> the findings of his first report suggest that a large part of the Ryzen 7 9800X3D is just dummy silicon for structural integrity. Since when is material for structural integrity dummy?
Since tom's hardware needed to write a headline that would get clicks.
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#8Earlier quoted context omitted.
It says so in the article itself: >Excluding interconnects, the SRAM and CCD should add up to less than 20µm thick. To accommodate such small and fragile components, AMD has added a bulky layer of dummy silicon at the top and the bottom for structural integrity.
The article doesn't answer questions like whether this is unusual, if other CPUs historically have had a lot of dummy silicon, whether this is expensive or how it impacts the cost of production or how it affects the complexity of production itself. It's what I'd expect from modern journalism, but not really what I expect from good journalism.
Yeah. I think that other CPUs do also have a large chunk of 'dummy' silicon, except it's just the wafer that it's manufactured on the surface of, instead of a seperate part that's added after the wafer is ground down to allow for the connections through the back.
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#9Earlier quoted context omitted.
It says so in the article itself: >Excluding interconnects, the SRAM and CCD should add up to less than 20µm thick. To accommodate such small and fragile components, AMD has added a bulky layer of dummy silicon at the top and the bottom for structural integrity.
The article doesn't answer questions like whether this is unusual, if other CPUs historically have had a lot of dummy silicon, whether this is expensive or how it impacts the cost of production or how it affects the complexity of production itself. It's what I'd expect from modern journalism, but not really what I expect from good journalism.
Yes, people have found you can sand the die down by ~0.3mm on a 9900k if you are that desperate to improve temps by 2-3 degrees C: https://www.youtube.com/watch?v=O1ed_rBRb7Q&t=525s
Re: AMD 3D V-Cache teardown shows majority of the Ryzen 7 9800X3D is dummy silicon
#10Dummy silicon, in the same way as the majority of Leonardo's Mona Lisa is dummy wood panel (which supports the painting applied on top of it and ensures its structural integrity)? But how is this different from other chips out there? Ok, I get it that this is because of the chiplet technology used, but in a "traditional" chip the dummy silicon that provides the structural integrity would just be part of the chip, whi…
It says so in the article itself: >Excluding interconnects, the SRAM and CCD should add up to less than 20µm thick. To accommodate such small and fragile components, AMD has added a bulky layer of dummy silicon at the top and the bottom for structural integrity.
I'd say it's load bearing silicon. Like, literally.