Earlier quoted context omitted.
Indeed an in-package winbond flash die though.
Please explain. What is a better alternative that could have been chosen? I’m just happy to have one fewer component on my boards.
A potential alternative would have been a directly memory-mapped NOR flash die, but that would have required more bond wires, more dedicated pads on the die, a port on the bus, and on top of that the memory die would have been more expensive too.
An older (and often impractical) alternative is to use a single die with both flash and SoC on, in the same process. This usually forces a larger-than-desired process node to match the flash technology, making the SoC take up more space. The result requires no extra bond wires or pads, but now you're really manufacturing a flash chip with an MCU attached.