31–40 of 58 posts
Why not make cooling / heat dissipation part of the cpu?
You can have horizontal or vertical planes to guide the heat to the top or sides. chips are not 2D anymore, and this might allow for a slightly cooler core/inside temperature
That’s one part of the problem.. Why not make cooling / heat dissipation part of the cpu? You can have horizontal or vertical planes to guide the heat to the top or sides. chips are not 2D anymore, and this might allow for a slightly cooler core/inside temperature
For some reason I thought battery life was more constraining than cooling in mobile devices?
Different constraints. Better cooling allows the processor to throttle less and achieve higher average performance, which incidentally would also reduce your battery life if you had the processor running at 100% load the whole time.
Earlier quoted context omitted.
Different constraints. Better cooling allows the processor to throttle less and achieve higher average performance, which incidentally would also reduce your battery life if you had the processor running at 100% load the whole time.
Higher performance finishes the race to idle quicker and thus counterintuitively saves battery.
Best battery/power savings are achieved running as low as possible voltage for as high as possible frequency. At such voltages the CPUs/APUs are less likely to throttle to begin with.
Earlier quoted context omitted.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
Indium gallium dries out. It needs annual repasting. Also, using too much thermal paste is not an issue. What matters is mounting pressure and geometry. Replacing the bendy Independent Loading Mechanism (ILM) with an aftermarket square bracket. If you want to go further you can lap the IHS or even delid for direct-die cooling. Delid for liquid metal TIM in between the IHS and die made sense for a few years, but Intel…
Earlier quoted context omitted.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
Aside from Indium Gallium paste drying out as another post mentioned, it also has significant downsides. A big one is that it's electrically conductive so if it gets on the motherboard or oozes off the cpu, it can short out things on the motherboard. Another one is that the gallium in liquid metal will react with metals like aluminum, copper, and nickel and over the long term might cause bad things to occur.
Earlier quoted context omitted.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
If this is true, why not have coolers built into the CPU? Like a block of metal attached? Is it a small improvement gained? Or manufacturing nightmare?
But I guess it would be fine for mobile devices.
Suspicously absent in the diagram.. dust and particles.. i guess its a closed inner air circuit transporting the heat towards some large scale shedding surface. Also, is this something similar to the https://en.wikipedia.org/wiki/Venturi_effect ?