A startup’s cooling chip may surge processor power
allaboutcircuits.com
A startup’s cooling chip may surge processor power
1–10 of 58 posts
Re: A startup’s cooling chip may surge processor power
#2> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively.
Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though.
Edit: I missed the callout about laptops and tablets as I was skimming.
Re: A startup’s cooling chip may surge processor power
#3> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively. Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though. Edit: I missed the callout about laptops and tablets as I was skimming.
If you are interested in cooling, I suggest that you replace your thermal paste.
In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness.
Or use one made of a metal alloy:
Re: A startup’s cooling chip may surge processor power
#4I'm just really glad its not some Peltier junction solution. It looks like it could be a boon for low power devices that throttle easily such as tablets, maybe even phones and ultra thing laptops. Might even make cooling for non-cpu chips easier.
Re: A startup’s cooling chip may surge processor power
#5> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively. Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though. Edit: I missed the callout about laptops and tablets as I was skimming.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
> In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline.
Well, the second least conducting after what is meant to replace: Air.
And it makes sense, if it were more thermally conducting, then you should just make the entire cooler out of thermal paste.
Re: A startup’s cooling chip may surge processor power
#6> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively. Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though. Edit: I missed the callout about laptops and tablets as I was skimming.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
[deleted]
Re: A startup’s cooling chip may surge processor power
#7> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively. Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though. Edit: I missed the callout about laptops and tablets as I was skimming.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
Indium gallium dries out. It needs annual repasting.
Also, using too much thermal paste is not an issue. What matters is mounting pressure and geometry. Replacing the bendy Independent Loading Mechanism (ILM) with an aftermarket square bracket. If you want to go further you can lap the IHS or even delid for direct-die cooling.
Delid for liquid metal TIM in between the IHS and die made sense for a few years, but Intel has switched backed to solder, so the only gain to be had with delidding these days is with direct die.
Re: A startup’s cooling chip may surge processor power
#8I'm just really glad its not some Peltier junction solution. It looks like it could be a boon for low power devices that throttle easily such as tablets, maybe even phones and ultra thing laptops. Might even make cooling for non-cpu chips easier.
I feel like these are not as common/popular as they were back in the day. Now it's all water cooling with those all-in-one setups. I always thought the Peltier coolers were cool (pun not originally intended, but now it is).
Re: A startup’s cooling chip may surge processor power
#9> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively. Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though. Edit: I missed the callout about laptops and tablets as I was skimming.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
Aside from Indium Gallium paste drying out as another post mentioned, it also has significant downsides. A big one is that it's electrically conductive so if it gets on the motherboard or oozes off the cpu, it can short out things on the motherboard. Another one is that the gallium in liquid metal will react with metals like aluminum, copper, and nickel and over the long term might cause bad things to occur.
Re: A startup’s cooling chip may surge processor power
#10> The AirJet datasheets report a power dissipation of 5.25 W and 10.5 W using the AirJet Mini and Pro, respectively. Ah, beans. Was hoping for something more applicable to desktop processors. Neat idea though. Edit: I missed the callout about laptops and tablets as I was skimming.
If you are interested in cooling, I suggest that you replace your thermal paste. In my research I have found that the thermal paste is, paradoxically, the least thermally conducting part of a PC heat pipeline. So, use as little of it as possible, to avoid adding thickness. Or use one made of a metal alloy: https://www.youtube.com/watch?v=hdTsra-uLBI
> ...use as little of it as possible, to avoid adding thickness.
You might be interested in watching this: https://www.youtube.com/watch?v=EUWVVTY63hc> and maybe also this: https://www.youtube.com/watch?v=nWu2tcm4wL8>. Do note that the videos contain graphs which summarize the findings.