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How do they do heat management and dissipation on such a big wafer? I can imagine some different parts heats up differently, putting a mechanical strain on wafer, and leading to cracks.
The article mentions a year of engineering went into dealing with the entire wafer thermally expanding under load.
Most interesting aspect of wafer-scale manufacturing is yield. Even if we have 95% chip yield, as the chip size approaches the wafer-level dimensions, I don't know off top of my head what the math would be but it is going to plummet drastically. My guess is that they're handling this in the chip logic. Building resiliency by turning off cells in the wafer that didn't yield. That begs the question, how are they probin…
"When we spoke to Cerebras last year, the company stated that they already had orders in the ‘strong double digits’."
And they cost 2- 2.5 million each!
https://www.anandtech.com/show/15838/cerebras-wafer-scale-en...
Time for an AI winter I guess.
You do realize that AI crossed human expert performance in NLP / Vision tasks ?
I'd be glad to learn I'm wrong.
How much memory is on the chip, and what kind is it? Under what circumstances does the chip need to access external memory? What type of communication interfaces does this chip have? Also, if the chip is the size of a wafer, is it appropriate to call it a Chip?
(more than the IEEE)
This thing pulls 15-20kW of juice!
How much memory is on the chip, and what kind is it? Under what circumstances does the chip need to access external memory? What type of communication interfaces does this chip have? Also, if the chip is the size of a wafer, is it appropriate to call it a Chip?
How much memory is on the chip, and what kind is it? Under what circumstances does the chip need to access external memory? What type of communication interfaces does this chip have? Also, if the chip is the size of a wafer, is it appropriate to call it a Chip?
> Also, if the chip is the size of a wafer, is it appropriate to call it a Chip?
Good question. I think it is. I mean the word "chip" isn't really that well defined (is HBM one chip?), but given that they sell it as a single unit and you can't really cut it in half I think it's one chip.
How do they do heat management and dissipation on such a big wafer? I can imagine some different parts heats up differently, putting a mechanical strain on wafer, and leading to cracks.
A large portion of the article is answering most of this
How much memory is on the chip, and what kind is it? Under what circumstances does the chip need to access external memory? What type of communication interfaces does this chip have? Also, if the chip is the size of a wafer, is it appropriate to call it a Chip?
Tom's Hardware has some nice tables comparing the specs: https://www.tomshardware.com/news/cerebras-wafer-scale-engin... (more than the IEEE) This thing pulls 15-20kW of juice!
It may be a very large wafer but dissipating that heat is still very impressive.