MacBook Pro with i9 chip is throttled due to thermal issues, claims YouTuber

Post by some_account » Wed, Jul 18, 2018, 2:24 PM UTC

wtallis wrote: post #283

mrweasel wrote: post #276

Earlier quoted context omitted.

It's not just Apple, the thermal paste between the die and the heat spreader on newer Intel CPUs isn't getting good reviews either. Replacing the paste under the heat spreader is a lot more tricky though, and requires special tools. Why neither Apple nor Intel is opting for better thermal compound is amazing. Tests continue to CPU temperatures drop 10+ degrees (C) just by replacing the thermal compound. Even if they…

It may not hurt their margins much to use more expensive thermal compound, but it definitely won't help them in any meaningful way. These products are optimized for real-world bursty workloads that basically never hit a serious thermal limit that better paste could help with. Even on the desktop chips, delidding and replacing the thermal compound provides no benefit until you're pretty far into overclocking territory…

Post by [deleted] » Wed, Jul 18, 2018, 2:34 PM UTC

MaxBarraclough wrote: post #335

morganvachon wrote: post #293

Earlier quoted context omitted.

> For example, the thermal conductivity of a high-grade thermal paste is 8.5 W/mK, and the heat conductivity of copper is 385 W/mK, or for aluminum 205 W/mK. You can see that the thermal compound is actually a poor heat conductor and that is exactly the reason why you only need a very thin layer of paste to fill the micro imperfections between the IHS and heatsink. This has always been my rule of thumb whether it's m…

For what it's worth, Arctic Silver recommend not to use your finger, on account of dead skin cells and grease. Page 4, http://www.arcticsilver.com/pdf/appmeth/int/vl/intel_app_met...

Post by slantyyz » Wed, Jul 18, 2018, 2:38 PM UTC

roryisok wrote: post #337

bischofs wrote: post #328

At this point, people in the Mac hardware engineering leadership need to start submitting their resignations or being forced out. This kind of sloppy engineering and lack of product focus is the antithesis of what Apple has stood for. If I were Tim Cook I would fire Dan Riccio, and then resign myself and hand the company over to someone who cares about products and not supply chain optimization. Also the whole execut…

If Tim Cook hasn't stepped down over all apple failures he's overseen, he's not going to do it because the new MacBook gets hot.

Post by bitwize » Wed, Jul 18, 2018, 2:52 PM UTC

bischofs wrote: post #328

At this point, people in the Mac hardware engineering leadership need to start submitting their resignations or being forced out. This kind of sloppy engineering and lack of product focus is the antithesis of what Apple has stood for. If I were Tim Cook I would fire Dan Riccio, and then resign myself and hand the company over to someone who cares about products and not supply chain optimization. Also the whole execut…

Post by drb91 » Wed, Jul 18, 2018, 3:00 PM UTC

bitwize wrote: post #347

bischofs wrote: post #328

At this point, people in the Mac hardware engineering leadership need to start submitting their resignations or being forced out. This kind of sloppy engineering and lack of product focus is the antithesis of what Apple has stood for. If I were Tim Cook I would fire Dan Riccio, and then resign myself and hand the company over to someone who cares about products and not supply chain optimization. Also the whole execut…

The thing is, the MBP is fulfilling Apple's design goals: they are optimizing for thinness, lightness, and battery life, not performance or thermal dissipation. As long as the thing doesn't break (in a way that can't be fixed trivially by the Geniuses at the Genius Bar) everything's fine as far as Apple's business is concerned.