Viewing profile — craigjb

We’re at approximately where PCB pricing was 20 years ago, which _is_ a big deal: https://wafer.space

Apple has not shipped an InFO-PoP with side-by-side integrated die yet. This is expected to be the first one, using RDLs for the die-to-die interconnect (so different than M-Ultra …

Applied Materials, Lam Research, and KLA are all U.S. companies. ASML supplies lithography, but hundreds of other tools come from these companies.

The terms to search for are fan-out wafer level packaging (FOWLP) and TSMC InFO. The chiplets come from different wafers and are reconstituted into a molded plastic wafer, allowing…

7nm for Achronix https://www.achronix.com/product/speedster7t-fpgas

Equipment for ion implantation already includes mini accelerators [1] [2]. The semiconductor equipment industry in general has many machines that feel like they came out of a physi…

You also need hundreds of other machines from Applied Materials, KLA Tencor, Lam Research, Tokyo Electron, etc. Then, years of process development R&D: what temperature do we bake …

You are absolutely correct that design costs swamp mask costs by far. For 7 nm, it costs more than $271 million for design alone (EDA, verification, synthesis, layout, sign-off, et…

I built the Gameslab around this concept, but haven’t worked on it much lately. https://craigjb.com/2019/11/26/gameslab-overview/

Keep in mind, a semiconductor fab has hundreds of other machines and equipment involved, and US companies are some of the biggest suppliers (Applied Materials, Lam Research, KLA-Te…

TSMC's plans for Arizona have been increased to start with 100k per month with future phases up to 200k [1] [1] https://technosports.co.in/2021/03/03/tsmc-to-build-5nm-plan...