Earlier quoted context omitted.
The whole “exploding tiny drops of metal” in the middle of this is just Loony Toons. This machine is literally insane and two of the companies I am long-long on would be completely fucked without it.
You forgot WITH LASERS, and IN A VACUUM
ASML unveils EUV light source advance that could yield 50% more chips by 2030
61–70 of 111 posts
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#62Earlier quoted context omitted.
There is such a thing as X-ray lithography, but it comes with significant challenges that make it not really worth it compared to EUV.
I'd like to hear more about these challenges
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#63Earlier quoted context omitted.
As I understand it, primarly because due to the high energy level of x-rays, light x-ray interacts very differently with materials[1]. Primarily they get absorbed, so very difficult to make mirrors or lenses, which are crucial for litography to redirect and focus the light on a specific miniscule point on the wafer. The primary method is to rely grazing angle reflection, but that per definition only allows you a tiny…
All of these problems or equivalent still exist in EUV. Litho industry had to kind of rethink the source and scanner because it went from all lenses to all mirrors in EUV. This is also why low NA and high NA EUV scanners were different phases. As I hear it, the decision had large economic component related to Masks and even OPC.
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#64Earlier quoted context omitted.
The whole “exploding tiny drops of metal” in the middle of this is just Loony Toons. This machine is literally insane and two of the companies I am long-long on would be completely fucked without it.
You forgot WITH LASERS, and IN A VACUUM
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#65Earlier quoted context omitted.
Okay this is weird. > The key advancements in Monday's disclosure involved doubling the number of tin drops to about 100,000 every second, and shaping them into plasma using two smaller laser bursts, as opposed to today's machines that use a single shaping burst. This is covered in that video. Did they let him leak their Q1 plans?
That has been covered before in other videos[0] that this is their roadmap to higher power, so I'm also not sure what they have announced now that wasn't previously announced. [0]: https://www.youtube.com/watch?v=MXnrzS3aGeM
This seems like a product with a very very long sales pipeline, so I wonder if they work on pre-orders with existing customers but announce delivery milestones only as they come?
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#66Earlier quoted context omitted.
You forgot WITH LASERS, and IN A VACUUM
IIRC from the Veritasium video[0] there is actually some hydrogen gas flowing at quite a high speed though the laser chamber to carry away the tin debris so that it does not accumulate on the mirrors. [0] https://www.youtube.com/watch?v=MiUHjLxm3V0
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#67This video is a really cool dive into EUV for the uninitiated (me) https://youtu.be/MiUHjLxm3V0?si=kEPSicC2WXYhcQ6L
The whole “exploding tiny drops of metal” in the middle of this is just Loony Toons. This machine is literally insane and two of the companies I am long-long on would be completely fucked without it.
So much more fun than LEDs.
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#68Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#69Earlier quoted context omitted.
https://youtu.be/NGFhc8R_uO4 Or this presentation which came out way long ago.
"I didn't want my name associated with this on the internet"
I’ll note that this video is way out of date…both in content and my skills as a speaker :P
Re: ASML unveils EUV light source advance that could yield 50% more chips by 2030
#70Earlier quoted context omitted.
Yeah it's an interesting angle in the article. The EUV light source technology is completely designed, developed, and manufactured by Cymer in California, which is a US company that ASML acquired in 2013. If export control agreements were not in place then ASML would have never been permitted to acquire Cymer. And if they are not enforced then the US would almost certainly require ASML to sell Cymer back to US owners…
There is much more in an ASML machine, besides the UV source. So the ASML machines combine technologies developed in various places, not only in USA, even if the UV source is indeed a critical component. While an ASML machine would not work without the UV source, it would also not work without many other critical optical and mechanical components. If it were so easy to make a lithography machine when you have a UV so…
The primary difference between this machine and its predecessor is the degree to which it has been optimized around the specific EUV light source.