51–59 of 59 posts
Earlier quoted context omitted.
I would argue it's technically a difference in °K not °C.
Kelvin has no degrees sign (°) because it’s an absolute unit. https://sciencenotes.org/why-there-is-no-degree-in-kelvin-te...
Earlier quoted context omitted.
It's C. In terms of if it's bad? shrug . With a smaller heat sink, the chips are almost certainly going to be hotter (dunno how much.. at least 3-5 degrees, maybe up to 10?). Does that matter? Tech youtubers love to emphasize cooling - which is fair, I think it's important, but I also think it's overdone. From the end-user standpoint, the question is does this meaningfully increase the rate that their unit thermal th…
Tech YouTubers love to emphasize cooling because most if not all laptops are thermally limited.
But gaming console is designed to not to thermal throttled and no boost (or little boost), and console is some feet away from user, so the heat importance is different.
Earlier quoted context omitted.
I think for the end user the primary concern is not performance, but the potential fan noise. If the performance goes up or down, end users might not even notice, but if the fan is constantly kicking in and being too loud too often, more people will be concerned.
In the brief testing Austin Evans did in his YouTube video comparing the two, the new model was actually a touch quieter and a few degrees warmer. Of course that may not hold in all scenarios but it's something to note.
Earlier quoted context omitted.
The ps5 isn’t the only console that does not like to be enclosed in a cabinet with adequate airflow
Nope, like I said, it's the only console, PC, or 7.1 receiver that doesn't like to be enclosed in this particular cabinet in the 10 years I've had it. It's not enclosed, the back is open and separated from the wall by about 5 inches. Which is why it's all the more alarming that they've made the cooling system in the PS5 even worse.
Reminds me of this recent story on Reddit where a Xbox Series X overheats and blows up: https://www.reddit.com/r/gaming/comments/pdvcct/my_xbox_seri... I will be skipping this generation. Not that it matters anyway, these consoles are impossible to find and buy, at least this will continue to be the case well into 2022.
Consoles have design lifetimes, and thermals are part of the computation that helps you figure out if your components are going to last as long as the warranty. Obviously, if you run a chip hot, its service life will be reduced. So companies develop models that tell them how long things like the SOC (main chip with CPU, etc.) will last for a given temperature and use frequency, and whether or not they've got a 1-year…
Hopefully the industry has improved their estimates since the Xbox 360
EU at this time put a deadline to the end of use for lead based solder, so the move to leadfree solder was done right before moving to mass manufacturing. The poor cooling solution on the 360 compared to its heat output didn't do the system justice. The PCB would flex as it would not be heated evenly.
After Die shrinks and manufacturing revisions, more mature lead free solder also used. The Jasper units were pretty much tanks, and the cooling solution was oversized as they were the same as before with the much hotter and power demanding lager die first gen chips.
Video Cards from the era of the launch 360 are notoriously unreliable for the same reasons. Heat cycles were a death wish, luckily for videocards they normally had a cool down period after gaming idling at a desktop. While the 360 would commonly go from 100% load term load to off.
Earlier quoted context omitted.
I can't get a source for this right now, but I remember having a very intriguing conversation about heat issues and the xbox 360 years ago. I was talking to an old colleague of mine that was an electronics engineer, and apparently, the issue with the xbox 360 was that the heat inside the case made the solder a bit more softer than expected. This would not be an issue for a horizontally positioned xbox 360, but when p…
Yes this was absolutely true. I used to repair these systems when they got the dreaded red ring of death. Microsoft used inferior solder, and coupled this with a poorly designed heatsink mounting bracket. The heatsink mounting bracket on the back of the motherboard was bowed by design, and would pull back on the corners of the CPU, while a middle contact point would press up on the center of the CPU socket. Once heat…
This would mean no more stress.
I'm intruiged as to why it would only work for eight months, why wasn't the fix "permanent"?
Earlier quoted context omitted.
Yes this was absolutely true. I used to repair these systems when they got the dreaded red ring of death. Microsoft used inferior solder, and coupled this with a poorly designed heatsink mounting bracket. The heatsink mounting bracket on the back of the motherboard was bowed by design, and would pull back on the corners of the CPU, while a middle contact point would press up on the center of the CPU socket. Once heat…
Surely the best countermeasure to worsening of the issue would be to advise people to place the xbox 360 horiztonally, no? This would mean no more stress. I'm intruiged as to why it would only work for eight months, why wasn't the fix "permanent"?
I tried looking for a good visual example and this article describes the issue, and fix, pretty well.
https://www.instructables.com/Fix-the-Red-Ring-of-Deathwitho...
The fix would only last so long because once a ball grid array looses connections there is no real fix. It takes very special equipment to create those connections in the first place.
If you search "ball grid array soldering" on YouTube you'll see what I'm talking about. They're a real pain to try to fix once broken.