Earlier quoted context omitted.
Chiplets aren’t a desired technology. It’s done for either yield (more common) or thermal reasons (less common). It’s not something to brag about.
There's some truth to this in the sense that a single die would almost always have better performance than chiplets, but chiplets also reduce cost and they make larger core counts possible. A single die literally can't fit more than ~48 big cores with the associated cache and I/O, so 56, 64, or 96-core processors are only possible using chiplets.
Intel went the EMIB route to route through embedded silicon but people need to be reminded on HN that chiplet/fabric architecture is not something to brag about as a feature - which is what a lot of comments are doing (AMD did it first!). Intel went through this mess because they had to due to yield. It ain't a feature for the customer.