Earlier quoted context omitted.
5 Billion Euros of public money out of a total of 10 Billion invested. So it is more like "the German state builds a fab, with TSMC and others also investing a little".
>The planned joint venture will be 70% owned by TSMC, with Bosch, Infineon, and NXP each holding 10% equity stake, subject to regulatory approvals and other conditions. I wonder what them "providing" 5 billions as news reports put it actually means. Is this a loan, a gift, or some other type of deal?
TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
41–50 of 526 posts
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#42Wonder if the Taiwanese govt at some point will step in and block these onshoring measures as a matter of national security. If countries are less reliant on manufacturing within Taiwan, its one less reason to stand up to Beijing's one China principle.
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#43Earlier quoted context omitted.
Dresden has been a semimanufactoring hub in Eastern Germany for quite some time. I believe this started in GDR times and continued (at massively reduced capacity) after the reunification. Intel, AMD, Infineon and others operate (or plan to build) factories in Dresend (or saxony in general) and its reasonable to assume that experienced workers and local suppliers make the area a preffered location. Given Eastern Germa…
Intel will settle in Magdeburg. The "AMD" Fab in Dresden belongs to GlobalFoundries (AMD sold its last GlobalFoundries shares in 2012).
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#44Earlier quoted context omitted.
The likes of Bosch/Infineon/NXP are not interested in bleeding edge fabs, they sell embedded CPUs from very old fabs they still have. So this is an advancement for them, and totally sufficient for embedded stuff.
> totally sufficient for embedded stuff. No, TSMC 22 has no eFLASH, expensive SRAM, lacking of analog capability, lacks high temperature tolerance, and is tied to multiple patterning design flow. TSMC 40 on the other hand is the last portable node, with MRAM, eFLASH, high temp, some mixed signal, RF, no MP, and everything else your soul desires.
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#45Sort of incredible that Germany is getting decade old technology for this much investment.
A lot of the 'chip shortage' those past years was not for the cutting-edge stuff, but for automotive/embedded devices Not everything needs the 5nm cutting edge, and to be fair calling > 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, old is a bit unfair
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#46Great to see they coming to Germany. If Tesla could build a car factory here from scratch, I'm sure that they can build chips too. Curious why they've chosen Dresden though. Anybody knows how much the government is willing to invest? Missing some tangible figures.
> Curious why they've chosen Dresden though. The region is known for its semiconductor industry, at least in Germany. Quote from Wikipedia about Dresden: > Silicon Saxony Saxony's semiconductor industry was built up in 1969. Major enterprises today include AMD's semiconductor fabrication spin-off GlobalFoundries, Infineon Technologies, ZMDI and Toppan Photomasks. Their factories attract many suppliers of material and…
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#47Earlier quoted context omitted.
They won't use that technology to produce mobile phones or GPUs. There are plenty of application were structure size, performance and/or power draw doesn't really matter. E.g. Automotive / Industrial applications
That's exactly the issue, isn't it? The Chips Act was marketed as an attempt to bring back "cutting-edge chips" to Europe, and to promote research and innovation. In the end it turns out to just be a huge government subsidy for a bog-standard fab which is at least a decade behind what TSMC is building in Taiwan. Great for automotive companies who want to strengthen their supply lines, but pretty pointless when it com…
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#48Earlier quoted context omitted.
They won't use that technology to produce mobile phones or GPUs. There are plenty of application were structure size, performance and/or power draw doesn't really matter. E.g. Automotive / Industrial applications
That's exactly the issue, isn't it? The Chips Act was marketed as an attempt to bring back "cutting-edge chips" to Europe, and to promote research and innovation. In the end it turns out to just be a huge government subsidy for a bog-standard fab which is at least a decade behind what TSMC is building in Taiwan. Great for automotive companies who want to strengthen their supply lines, but pretty pointless when it com…
It's not a dumb approach.
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#49Wonder if the Taiwanese govt at some point will step in and block these onshoring measures as a matter of national security. If countries are less reliant on manufacturing within Taiwan, its one less reason to stand up to Beijing's one China principle.
Re: TSMC, Bosch, Infineon, NXP to jointly build semiconductor fab in Europe
#50Sort of incredible that Germany is getting decade old technology for this much investment.
A lot of the 'chip shortage' those past years was not for the cutting-edge stuff, but for automotive/embedded devices Not everything needs the 5nm cutting edge, and to be fair calling > 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, old is a bit unfair
22nm dates back to 2012, and TSMC has been doing 14nm FinFET mass production since 2014. So yeah, a decade behind cutting-edge can indeed be called "old" when the entire point of the Chips Act was to catch up with Asia and become a center for innovation.