The picture shows 8 tiny fans mounted inside (not counting the fan probably inside the PS) I would have thought that part of the reason for going to ARM is the low power - hopefully no moving parts. It would have been cool (ha) to see them pull it off without fans.
32 cores of fast ARM in half-depth 1U case
31–40 of 41 posts
Re: 32 cores of fast ARM in half-depth 1U case
#32Calxeda has been building 16 core cards[1] for awhile now with about 18 fitting in a 1U-sized box[2], each card connected by 10GbE similar to this[3]. [1]: http://www.calxeda.com/technology/products/energycards/quadn... [2]: http://semiaccurate.com/2011/11/03/calxeda-launches-a-4-core... [3]: http://www.calxeda.com/wp-content/uploads/2012/06/EnergyCard...
Not to mention Tilera, who makes 36-core chips/cards [1], with 4 in a 1U box [2], with each processor with connected to each its four neighbors by a 250 Gb/s link. [1] http://tilera.com/products/processors/TILE-Gx_Family [2] http://tilera.com/products/platforms [3] http://www.tilera.com/technology
Re: 32 cores of fast ARM in half-depth 1U case
#33Imagine a Beowulf of those!
I know you meant that as a joke, but I'd imagine one of these really would be an excellent candidate for being turned into a cluster.
Re: 32 cores of fast ARM in half-depth 1U case
#34Re: 32 cores of fast ARM in half-depth 1U case
#35Calxeda has been building 16 core cards[1] for awhile now with about 18 fitting in a 1U-sized box[2], each card connected by 10GbE similar to this[3]. [1]: http://www.calxeda.com/technology/products/energycards/quadn... [2]: http://semiaccurate.com/2011/11/03/calxeda-launches-a-4-core... [3]: http://www.calxeda.com/wp-content/uploads/2012/06/EnergyCard...
Not to mention Tilera, who makes 36-core chips/cards [1], with 4 in a 1U box [2], with each processor with connected to each its four neighbors by a 250 Gb/s link. [1] http://tilera.com/products/processors/TILE-Gx_Family [2] http://tilera.com/products/platforms [3] http://www.tilera.com/technology
It is an interesting system though.
Re: 32 cores of fast ARM in half-depth 1U case
#36Calxeda has been building 16 core cards[1] for awhile now with about 18 fitting in a 1U-sized box[2], each card connected by 10GbE similar to this[3]. [1]: http://www.calxeda.com/technology/products/energycards/quadn... [2]: http://semiaccurate.com/2011/11/03/calxeda-launches-a-4-core... [3]: http://www.calxeda.com/wp-content/uploads/2012/06/EnergyCard...
Not to mention Tilera, who makes 36-core chips/cards [1], with 4 in a 1U box [2], with each processor with connected to each its four neighbors by a 250 Gb/s link. [1] http://tilera.com/products/processors/TILE-Gx_Family [2] http://tilera.com/products/platforms [3] http://www.tilera.com/technology
There were other companies like Tilera: Transputer, Connection Machine.......SiCortex was founded in 2003 with a similar idea and was shutting down by 2009
The problems with these architectures is cost: mass market tech like x86 and ARM offers more bang for your buck
Re: 32 cores of fast ARM in half-depth 1U case
#37From my understanding of ARM architecture, ARM cores cannot process heavy data loads in a power-efficient manner, making TDP under heavy server conditions prohibitively high. Am I right about this? I've never tried making an ARM server of my own.
Re: 32 cores of fast ARM in half-depth 1U case
#38From my understanding of ARM architecture, ARM cores cannot process heavy data loads in a power-efficient manner, making TDP under heavy server conditions prohibitively high. Am I right about this? I've never tried making an ARM server of my own.
What understanding is it that you have that suggests that? It can shovel data via DMA as well as the next architecture.
Re: 32 cores of fast ARM in half-depth 1U case
#39Earlier quoted context omitted.
Been a while since I was heavily involved in high-density data centers... How does that work with traditional hot aisle/cold aisle layouts? Seems like you'd need to adjust the cooling to have an air channel up the middle of the rack?
You could do, or have one of them exhaust to its "front", and the other exhaust to its "back".
*Note I am used to normal data-centers but not high density stuff. I don't know of the special provisions a high-density setup would have.
Re: 32 cores of fast ARM in half-depth 1U case
#40Earlier quoted context omitted.
You could do, or have one of them exhaust to its "front", and the other exhaust to its "back".
So the one at the "back" is getting pre-warmed air. Wouldn't this be a problem? *Note I am used to normal data-centers but not high density stuff. I don't know of the special provisions a high-density setup would have.
They're ARMs, they don't need much cooling anyway.