> The chip machines Taiwan uses come from Europe, for example
The US, not Europe.
ASML's EUV and High NA EUV production is all done in California via US DoE joint ventures (specifically Cymer LLC [0]). Additionally, their metrology IP is Taiwanese [1] as part of ASML's acquisition of HMI back in 2016 with Taiwanese approval [2].
ASML is the capital partner because in the early 2000s, the US government wanted to prevent a duopoly forming between Nikon and Canon for photolithography as part of an antitrust battle.
And the next generation of lithography tooling coming into Taiwan is being funded and developed by Japan [3] due to MUFG, Mitsui, Mizuho, and SoftBank becoming the primary capital partners for Taiwan's electronics industry [4]. This is also why TSMC is expanding in Japan and Taiwanese players are transferring IP to Rapidus.
Additonally, all the packaging, testing, and design work - especially leading edge nodes - is done in Asia, the US, and even Israel but not Europe.
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Personally, I think Europe is too far behind at this point for the EUV and High NA EUV boom - Taiwan, the US, Japan, South Korea, China, and others deployed significant amounts of capital and subsidizes in the late 2010s and early 2020s and worked to build IP partnerships for front-end work with players like TSMC (US, Japan), UMC (China until 2019), PSMC (Japan, India), and Samsung (US).
The EU had a shot but Intel rolled back their Germany expansion plan in order to double down on 18A in Arizona, and TSMC decided to double down on Japan. Additonally, all the backend work is done in Taiwan, South Korea, China, ASEAN (Malaysia, Thailand, Vietnam), Japan, the US, and even India now because Micron, Samsung, Amkor, and others transferred their IP there, and design is primarily concentrated in Taiwan, the US, China, Israel, and India and with Malaysia and Vietnam likely to become much more prominent in the next few years due to Arm and Marvell respectively.
What the EU can instead do is concentrate on power electronics (already a strong suite) and compound semiconductors (already a strong suite) and target a leapfrog technology like 2D semiconductor design and fabrication which is still in it's infancy and also has applications for quantum computing. The EU already has the capacity for "legacy" (but still critical) semiconductors but is too late to the game for sub-14nm fabrication.
And based on the kind of fundamental research and funding I've been seeing in the EU, this is the strategy that appears to be increasingly adopted within the EU - but this is something the US, China, Japan, South Korea, Taiwan, Israel, the UK, Singapore, Canada, and even Vietnam and India are doing as well, and both French and German initiatives risk being misaligned due to mutual industrial competition. The fact that French players in the space would rather collaborate with Singaporean [5], Korean [6], American [7], Israeli [8], and Canadian [9] partners to develop IP instead of with other partners within Europe, it shows issues around misalignment.
On a separate note, as I mentioned before on HN, the French seem to be on the right track - other European states other than the UK less so. French players are much more ruthless and "American" in attitude.
[0] - https://www.cymer.com/
[1] - https://www.asml.com/en/company/about-asml/hmi
[2] - https://www.asml.com/en/news/press-releases/2016/asml-obtain...
[3] - https://www.nikkei.com/nkd/company/us/SNPS/news/?DisplayType...
[4] - https://asia.nikkei.com/business/tech/semiconductors/japan-l...
[5] - https://www.pasqal.com/newsroom/three-new-partnerships-signe...
[6] - https://www.pasqal.com/newsroom/pasqal-expands-into-korea/
[7] - https://gov-pritzker-newsroom.prezly.com/governor-pritzker-a...
[8] - https://www.quantum-machines.co/blog/pushing-the-boundaries-...
[9] - https://www.lemonde.fr/en/economy/article/2024/09/25/quebec-...