Are there also already analyses of these die shots, explaining what be concluded from them?
Apple A19 SoC die shot
21–30 of 80 posts
Re: Apple A19 SoC die shot
#22Re: Apple A19 SoC die shot
#23Re: Apple A19 SoC die shot
#24I think I see a bug.
Re: Apple A19 SoC die shot
#25Does anyone know what the block dot at 12 o'clock on the image is? https://chipwise.tech/wp-content/uploads/2025/09/A19_SoC_die...
Re: Apple A19 SoC die shot
#26Re: Apple A19 SoC die shot
#27Re: Apple A19 SoC die shot
#28Is there a link to a version that isn't almost entirely compression artifacts? This definitely isn't the original, since the blue text at the bottom right isn't even legible.
The A19 appears to be remarkably intricate chip.
Re: Apple A19 SoC die shot
#29English subtitles are recommended, unless you are better at Chinese than I am.
Re: Apple A19 SoC die shot
#30Earlier quoted context omitted.
It's definitely an "on the shoulders of giants standing on the shoulders of giants" thing. Insane breakthrough technologies on top of other insane breakthroughs. Firing lasers at microscopic molten drops of metal in a controlled enough manner to get massively consistent results like what??
It’s a mind blowing achievement, nothing below sorcery if you think about it. ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%. Here’s an incredible, very detailed video about it: htt…
Maybe the high water usage is at some other stage? Or intermediate preceding stages? I'd love to understand more end-to-end, as surely it isn't as easy as popping a wafer in a semi-truck trailer sized lithography machine.