Earlier quoted context omitted.
That seems a little too cynical. It matters how a customer might use a chip, such as the type of cooling that would be expected in a typical system using that model, and that's informed by the advertised specifications. Base clocks and the amount of SRAM also figure into TDP. No doubt there are completely arbitrary aspects to TDP driven purely by profit-focused market segmentation, but it's not just that. That said,…
No, clock speed and cache have nothing to do with TDP. AMD uses a simple formula to calculate TDP. It is the temperature of the IHS minus the air temperature measured at the cpu cooler’s intake fan, divided by a conversion faction in °C/W. But they don’t use real temperatures from real systems. They just make up a different set of temperatures for each CPU that they sell, so that the TDP comes out to the number that…
From your description the formula is how you would calculate the power for which a certain heatsink at a given ambient temperature would result in the specified IHS temperature.
The °C/W number is not a conversion factor but the thermal resistance[1] of the heatsink & paste, that is a physical property.
So unless I misunderstood you it's very much something real in physical terms.
[1]: https://fscdn.rohm.com/en/products/databook/applinote/common...