Ever since mold relicensed from AGPL to MIT (as part of mold 2.0 release), the worldwide need for making another fast linker has been greatly reduced, so I wasn't expecting a project like this to appear. And definitely wasn't expecting it to already be 2x faster than mold in some cases. Will keep an eye on this project to see how it evolves, best of luck to the author.
Why does AGPL Vs MIT matter for a linker?
What does that mean for a linker? If you ship a binary linked with an AGPL linker you need to offer the source of the linker? Or of the program being linked?